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READJan 2025 Edition
Welcome to the January 2025 Issue of ELE Times, packed with insights into groundbreaking technologies. Explore semiconductor testing in the AI era, led by Facestech, and discover OpenST Linux, the backbone of STM32 MPU systems. In automotive, zonal E/E architectures secure software-defined vehicles, while Panasonic leads electrified commercial vehicle innovations. Learn how algorithms power robotics, the 3-in-1 cable monitor simplifies connectivity, and Intel Xeon CPUs bridge embedded models to high-performance computing and much more.
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READDec 2024 Edition
As we wrap up an exciting year in tech innovation, the December 2024 Issue of ELE Times brings you groundbreaking insights into the future of AI, connectivity, healthcare, and communications. We explore cutting-edge innovations shaping the future of technology. Lightmatter's photonics chips are setting new standards for energy-efficient, high-performance AI, while opportunities in Functional Safety (FuSa) for AI products are revolutionizing reliability in critical industries. We also delve into the impact of Bluetooth 6.0 vs. 5.4 on wireless communication and explore how bridging the gap between sensors and AI computers is unlocking new possibilities. Additionally, we examine the roadmap for 6G technology and highlight the benefits of Time-Sensitive Networking (TSN) and much more.
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READNov 2024 Edition
The November issue of ELE Times brings you a comprehensive look at the latest technological advancements shaping the future of electronics and semiconductors. In this edition, we delve into the evolving landscape of compound semiconductors, with a special focus on how eBeam technology is transforming their development. We also explore the critical role of wide-bandgap semiconductors in powering the future of Software-Defined Vehicles (SDVs), while providing insights into cutting-edge technologies like mini-LED displays and radar vs. PIR solutions for optimal sensor selection. As the digital battlefield intensifies, mastering cyber awareness training is more important than ever, and we examine how to stay ahead in this area. The cover story highlights the evolution of automotive ultrasonic sensors, from park assist systems to their integral role in autonomous driving. Additionally, we take a deep dive into emerging topics such as 5G RedCap, semiconductor manufacturing technologies, AI orchestration, and innovations in networking, wireless tech, power ICs, and telecommunications.